The right time. The right technology. The right company.

Experts estimate that “The Internet of Things” (IoT) will be comprised of roughly 30 billion objects by 2020. The IoT allows objects to be sensed or controlled remotely across existing network infrastructure, creating opportunities for more direct integration of the physical world into computer-based systems, and resulting in improved efficiency, accuracy and economic benefit in addition to reduced human intervention (See reference WikiProject.; September 2016).

Many of the required devices will need sophisticated fabrication methods including equally sophisticated dicing techniques. MEMS, MOEMS, sensors and other devices will be designed and fabricated with Stealth technology as the preferred medium for final singulation or dicing. The addition of the Stealth Laser Dicing® Process fortifies our line of mechanical saws, which has been the de facto dicing standard for decades. The Stealth concept is ideal for active surfaces due to its non-contact method of wafer separation, sparing the device layer from exposure to water, sawdust, mechanical shock and loss of real estate (zero kerf loss benefit). GDSI will identify the optimal dicing conditions for each customer, leveraging either mechanical or the Stealth Dicing® process.

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